![]() ▪ Understanding and application of broad range of Industrial Engineering knowledge and tools (eg: work measurement, process mapping, facilities, AutoCAD, statistical tools). ▪ Prefer good attitude, work ethic and fast learner candidate. ▪ Work independently and good communication / interpersonal skill to liaise with cross function department. ▪ Extensive understanding/knowledge on manufacturing systemic like as MES, SAP. ▪ Strong in planning, ability of statistic analytical skill and systematic problem solving skill. ▪ Candidate with Project Management skill or NPI background would be a distinct advantage. ▪ Good contact window with Korean equipment matter and supplier for Flip-chip product. ▪ Knowledge and experience in advanced package stabilization & development for more than 16 years including large die Flip Chip BGA, Hybrid Flip Chip, System-in-Packages, etc. ▪ Knowledge of BOM (Bill of Material) for Flip-chip product & such as Underfill, Flux, TIM, Adhesive, Solder ball, etc. ▪ Must have Flip-chip PKG assembly experience including project managing for Flip-chip customer. 10 years of relevant industry, and more than 10 years managing and leading the department/ team. ▪ Bachelor’s degree in engineering with min. ▪ Support production as needed on yield improvement and cost reduction. ▪ Provide forecast and manage budget requirement for the new product bring up. ▪ Research the advance packaging technology roadmap and understand feasibility. ▪ Communicates with team member so that all goals, expectations and performance as compared to plan are well understood. ▪ Provide update in various forum to keep stakeholder aware of latest development status on the new product bring up. ▪ Drive cross function team in project initiating, planning, monitoring and execution to meets project scope in term on cost, timeline and quality requirement. ▪ Work with various process and equipment team in defining the new product requirement and support customer technical request. ▪ Drive individual engineering team on qualification of equipment for product bring up. ▪ To conduct technical feasibility check, define criticalness correlate to customer special requirement and bridging solutions accordingly. ![]() ▪ Accountable in overseeing (End to end) and provide direction to entire execution of the project technically. ▪ Lead and liaise with internal customer to plan, execute and result review on engineering activities for product bring up. ![]() ▪ Manage the development of assembly equipment infrastructure and solutions to meet the new production needs of the company. ▪ Leading projects to implement new technology realization by setting up project framework, team formation, initiate budgets, communication and milestone/cost tracking. ▪ Able to execute project management related with manufacturing systemic like as MES, SAP. ▪ Able to work intensively relating to Project Management or NPI and Design for Manufacturing (DFM). ▪ Drive & manage NPI & LVM Product yield to achieve target goal and quality excursion prevention. ▪ Able to execute independently BOM (Bill of Material) project for Flip-chip product & such as Underfill, Flux, TIM, Adhesive, Solder ball, etc. ![]() ▪ Responsible to stabilize & develop large die Flip Chip BGA, Hybrid Flip Chip, System-in-Packages. ▪ Able to work independently handling WLCSP, Flip-chip PKG assembly including project managing with any related Flip-chip customer. ![]()
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